Editorial Board

• Bilal M. Ayyub, University of Maryland, USA
• Suk joo Bae, Hanyang University, Republic of Korea
• Satish Bukkapatnam, Oklahoma State University, USA
• Kai Yuan Cai, Beijing University of Aeronautics and Astronautics, China
• Kin P. Cheung, National Institute of Standards and Technology, USA
• Kwai Sang Chin, City University of Hong Kong, Hong Kong
• Ratna Babu Chinnam, Wayne State University, USA
• Tadashi Dohi, Hiroshima University, Japan
• Fausto Fantini, Università di Modena e Reggio Emilia, Italy
• Mircea Grigoriu, Cornell University, USA
• Hongzhong Huang, University of Electronic Science and Technology of China, China
• Shuen L. Jeng, National Cheng Kung University, Taiwan
• Myong-Kee Jeong, Rutgers, The State University of New Jersey, USA
• Don O. Koval, University of Alberta, Canada
• Way Kuo, University of Tennessee, USA
• Xiaohu Li, Lanzhou University, China
• Nikolaos E. Limnios, Université de Technologie de Compiègne, France
• Christian N. Madu, Pace University, USA
• Mohammad Modarres, University of Maryland, USA
• Andrzej S. Nowak, University of Nebraska–Lincoln, USA
• Ajit K. Verma, Indian Institute of Technology, Bombay, India
• Richard C. M. Yam, City University of Hong Kong, Hong Kong
• Shigeru Yamada, Tottori University, Japan