Table 1: Electrochemical plating process at different bath compositions, (I) without any reinforcements powders, (II) in absence of surfactants solution, and (III) in presence of surfactants solution.

Bath composition (g/L)Operating conditions
SampleNiSO4·6H2ONiCl2·6H2OH3BO3SiCGraphiteCTABSDSC7H5NO3S (°C)pHDC (A/dm2)

I2002040551454.84
II2002040121000454.84
III2002040121551454.84