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Low Power RF and Millimeter-Wave ICs for Emerging Wireless Applications

Call for Papers

In the recent years, there has been a significant drive in academia and industry to demonstrate the low power integrated circuits and systems at RF and mm-wave frequencies for emerging applications such as biomedical imaging, security and safety surveillance, short-range and high data-rate wireless communications, and multistandard radios coexistence. It is a great challenge to develop the energy-efficiency mobile terminals to meet the ever-growing wireless market.

We invite original papers from building blocks to systems working at RF, mm-wave, and THz frequencies with focus on low power design techniques. Application includes cellular, WLAN, BT, Zigbee, GPS, WBAN, TV tuner, UWB, ISM, 60GHz radios, 77GHz radar, 120GHz high data-rate wireless, THz image, and so on. Potential topics include, but are not limited to:

  • Low power circuits and systems for wireless biomedical devices
  • Low power RF circuits for wearable wireless sensor networks
  • Wireless systems for standard-based applications up to 100GHz
  • Millimetre-wave ICs for ultrawideband wireless communications
  • RFIC/MMIC for biomedical imaging, security and safety surveillance, short-range high data-rate wireless communications, and so on
  • Digital radio or software-defined radio circuits and systems for wireless communications

Before submission authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/jece/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/jece/circuits.systems/rfm/ according to the following timetable:

Manuscript DueFriday, 11 April 2014
First Round of ReviewsFriday, 4 July 2014
Publication DateFriday, 29 August 2014

Lead Guest Editor

  • Keping Wang, University of Washington, Seattle, WA, USA

Guest Editors

  • Yan Zhao, University of California, Los Angeles, CA, USA
  • Zhi-Gong Wang, Southeast University China, Institute of RF- and OE-ICs, Nanjing, China
  • JaeWook Shin, University of California, Los Angeles, CA, USA