Editorial Board

• Francesco Calimeri, Università della Calabria, Italy
• Michelangelo Ceci, University of Bari, Italy
• Ting Chen, Soochow University, China
• Tamer Eren, Kirikkale University, Turkey
• Patrick Horain, Telecom SudParis, France
• Jian Jiao, Beijing University of Aeronautics & Astronautics, China
• Pankaj Karande, Rensselaer Polytechnic Institute, USA
• Kyungmee O. Kim, Konkuk University, Republic of Korea
• Ren-Jieh Kuo, National Taiwan University of Science and Technology, Taiwan
• Santiago Laín, Universidad Autónoma de Occidente, Colombia
• Jinwen Ma, Peking University, China
• Manuel Mazzara, Newcastle University, Italy
• Farhad Nabhani, Teesside University, United Kingdom
• Stoyan Nedeltchev, Institute of Technical Chemistry, Germany
• Hervé Panetto, University of Lorraine, France
• Alfredo Petrosino, University of Naples Parthenope, Italy
• Pedro Real, Universidad de Sevilla, Spain
• Luis Enrique Sánchez, Sicaman Nuevas Tecnologias S.L., Spain
• David G. Stork, Ricoh Innovations, USA
• Cenk Undey, Amgen, USA
• Vicente Vargas, University of San Diego, USA
• Kilari Veeraswamy, QIS College of Engineering and Technology, India
• Domenico Vitulano, Istituto Per Le Applicazioni Del Calcolo Mauro Picone, Italy
• Xingquan Zuo, Beijing University of Posts and Telecommunications, China