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Journal of Nanomaterials
Volume 2012 (2012), Article ID 173025, 7 pages
http://dx.doi.org/10.1155/2012/173025
Research Article

Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

1Spansion (Penang) Sdn Bhd, Phase II Free Industrial Zone, Penang, 119900 Bayan Lepas, Malaysia
2Institute of Nanoelectronic Engineering (INEE), Universiti Malaysia Perlis, Perlis, 01000 Kangar, Malaysia

Received 26 May 2012; Accepted 30 July 2012

Academic Editor: Fathallah Karimzadeh

Copyright © 2012 C. L. Gan et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [9 citations]

The following is the list of published articles that have cited the current article.

  • U. Hashim, “Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu W ires Post High Temperature Aging in Nanoscale Semiconductor Packaging,” Journal of Electronic Packaging, vol. 135, no. 2, 2013. View at Publisher · View at Google Scholar
  • Chong Leong Gan, Classe Francis, Bak Lee Chan, and Uda Hashim, “Extended reliability of gold and copper ball bonds in microelectronic packaging,” Gold Bulletin, 2013. View at Publisher · View at Google Scholar
  • C. L. Gan, and U. Hashim, “Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package,” Journal of Materials Science: Materials in Electronics, 2013. View at Publisher · View at Google Scholar
  • Hashim Uda, “Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Dop ed Cu Wire in Microelectronics Packaging,” Plos One, vol. 8, no. 11, 2013. View at Publisher · View at Google Scholar
  • Francis Classe, and Uda Hashim, “Superior performance and reliability of copper wire ball bonding in laminat e substrate based ball grid array,” Microelectronics International, vol. 30, no. 3, pp. 169–175, 2013. View at Publisher · View at Google Scholar
  • C. L. Gan, E. K. Ng, B. L. Chan, F. C. Classe, T. Kwuanjai, and U. Hashim, “Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging,” Journal of Nanomaterials, 2013. View at Publisher · View at Google Scholar
  • C. L. Gan, F. C. Classe, B. L. Chan, and U. Hashim, “Evolution and investigation of copper and gold ball bonds in extended reliability stressing,” Gold Bulletin, 2014. View at Publisher · View at Google Scholar
  • C. L. Gan, F. C. Classe, B. L. Chan, and U. Hashim, “Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging,” Journal of Electronic Materials, 2014. View at Publisher · View at Google Scholar
  • Qi-jing Lin, Weixuan Jing, Shu-ming Yang, Zhuang-de Jiang, and Chen-ying Wang, “Agglomeration and Dendritic Growth of Cu/Ti/Si Thin Film,” Journal of Nanomaterials, vol. 2014, pp. 1–8, 2014. View at Publisher · View at Google Scholar