About this Journal Submit a Manuscript Table of Contents
Journal of Nanomaterials
Volume 2012 (2012), Article ID 173025, 7 pages
http://dx.doi.org/10.1155/2012/173025
Research Article

Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

1Spansion (Penang) Sdn Bhd, Phase II Free Industrial Zone, Penang, 119900 Bayan Lepas, Malaysia
2Institute of Nanoelectronic Engineering (INEE), Universiti Malaysia Perlis, Perlis, 01000 Kangar, Malaysia

Received 26 May 2012; Accepted 30 July 2012

Academic Editor: Fathallah Karimzadeh

Copyright © 2012 C. L. Gan et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

C. L. Gan, E. K. Ng, B. L. Chan, U. Hashim, and F. C. Classe, “Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging,” Journal of Nanomaterials, vol. 2012, Article ID 173025, 7 pages, 2012. doi:10.1155/2012/173025