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Journal of Nanomaterials
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Journal of Nanomaterials
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2012
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Article
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Fig 1
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Research Article
Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging
Figure 1
(a) Cratering at both Cu ball bond edges of leg no. 2 (b) and (c) IMD (Inter Metal Dielectric crater and crack) at silicon level.