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Journal of Nanomaterials
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Journal of Nanomaterials
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2012
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Article
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Fig 4
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Research Article
Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging
Figure 4
(a) Cu ball bond, (b) and (c) edges of Cu ball bonds—no Cu ball bond corrosion or weaknesses with Green molding compound (Leg no. 3).
(a)
(b)
(c)