Table 1: Cu wirebonding reliability development study.

LegWire Experimental parameterGreen/non-green materialsUHAST 96 hr results
(no. of failures/sample size)

1Cu wireNominal bonding parameterGreen substrate
Green mold compound
0/25
2Cu wireHigh bonding parameterGreen substrate
Green mold compound
1/25
3Cu wireGreen mold compound (<20 ppm Cl)Green substrate
Green mold compound
0/50
4Cu wireNon-green mold compound (>20 ppm Cl)Green substrate
Non-green mold compound
31/50
5Cu wire3-days staging after wirebondGreen substrate
Green mold compound
0/50
6Cu wire7-days staging after wirebondGreen substrate
Green mold compound
2/50
7Cu wire10-days staging after wirebondGreen substrate
Green mold compound
1/50