Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

Table 1

Cu wirebonding reliability development study.

Leg	Wire	Experimental parameter	Green/non-green materials	UHAST 96 hr results; (no. of failures/sample size)
1	Cu wire	Nominal bonding parameter	Green substrate; Green mold compound	0/25
2	Cu wire	High bonding parameter	Green substrate; Green mold compound	1/25
3	Cu wire	Green mold compound (<20 ppm Cl^−)	Green substrate; Green mold compound	0/50
4	Cu wire	Non-green mold compound (>20 ppm Cl^−)	Green substrate; Non-green mold compound	31/50
5	Cu wire	3-days staging after wirebond	Green substrate; Green mold compound	0/50
6	Cu wire	7-days staging after wirebond	Green substrate; Green mold compound	2/50
7	Cu wire	10-days staging after wirebond	Green substrate; Green mold compound	1/50