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Journal of Nanomaterials
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Journal of Nanomaterials
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2012
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Article
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Tab 3
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Research Article
Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging
Table 3
EDX analysis of CuAl IMC crack region post-UHAST 96 hr opens: green mold compound (Leg 3).
Leg
Element
Atomic %
3 (Green mold compound)
O
1.48
Al
11.02
Si
0.98
Cu
83.14
Ta
3.38