963609.fig.004a
(a)
963609.fig.004b
(b)
963609.fig.004c
(c)
963609.fig.004d
(d)
Figure 4: TEM images of wormlike morphology of Ag deposited on carbon-coated copper grid at different sputtering currents: 100 mA for (a) and (b), and 150 mA for (c) and (d). All were deposited for 2 sec and 20 cm of target-substrate distance.