Growth of Silver Nanoparticles by DC Magnetron Sputtering
Figure 4
TEM images of wormlike morphology of Ag deposited on carbon-coated copper grid at different sputtering currents: 100 mA for (a) and (b), and 150 mA for (c) and (d). All were deposited for 2 sec and 20 cm of target-substrate distance.
