Research Article

The Liquid Sensor Using Thin Film Bulk Acoustic Resonator with C-Axis Tilted AlN Films

Figure 2

The fabrication processes for the dual-mode TFBAR devices.
245095.fig.002a
(a) Substrate cleaned by RCA process
245095.fig.002b
(b) deposited by LPCVD
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(c) etched by RIE
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(d) Bottom electrode deposited by DC sputter
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(e) AIN deposited by RF sputter
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(f) AIN etched
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(g) Top electrode deposited by DC sputter
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(h) Si etched by KOH