One-Step Fabrication of Hierarchically Structured Silicon Surfaces and Modification of Their Morphologies Using Sacrificial Layers
Figure 1
((a)–(d)) Fabrication of patternable hierarchically structured silicon surfaces, using deep reactive-ion etching (DRIE) based on the “black silicon” method and using a sacrificial layer. ((e), (f)) Scanning electron microscopy (SEM) images of the hierarchical structures.
