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Journal of Nanomaterials
Volume 2013 (2013), Article ID 486373, 9 pages
Research Article

Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

1Spansion (Penang) Sendirian Berhad, Phase II Industrial Zone, Penang, 11900 Bayan Lepas, Malaysia
2Institute of Nano Electronic Engineering (INEE), Universiti Malaysia Perlis, 01000 Kangar, Perlis, Malaysia
3Spansion Incorporation, Sunnyvale, CA 94085, USA
4Spansion (Thailand) Limited, 229 Moo 4 Changwattana Road, Nonthaburi 11120, Thailand

Received 14 October 2012; Revised 15 December 2012; Accepted 16 December 2012

Academic Editor: Sheng-Rui Jian

Copyright © 2013 C. L. Gan et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [3 citations]

The following is the list of published articles that have cited the current article.

  • Chong Leong Gan, Classe Francis, Bak Lee Chan, and Uda Hashim, “Extended reliability of gold and copper ball bonds in microelectronic packaging,” Gold Bulletin, 2013. View at Publisher · View at Google Scholar
  • C. L. Gan, and U. Hashim, “Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package,” Journal of Materials Science: Materials in Electronics, 2013. View at Publisher · View at Google Scholar
  • Gan Chong Leong, and Hashim Uda, “Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging,” Plos One, vol. 8, no. 11, 2013. View at Publisher · View at Google Scholar