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Journal of Nanomaterials
Volume 2013 (2013), Article ID 486373, 9 pages
Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging
1Spansion (Penang) Sendirian Berhad, Phase II Industrial Zone, Penang, 11900 Bayan Lepas, Malaysia
2Institute of Nano Electronic Engineering (INEE), Universiti Malaysia Perlis, 01000 Kangar, Perlis, Malaysia
3Spansion Incorporation, Sunnyvale, CA 94085, USA
4Spansion (Thailand) Limited, 229 Moo 4 Changwattana Road, Nonthaburi 11120, Thailand
Received 14 October 2012; Revised 15 December 2012; Accepted 16 December 2012
Academic Editor: Sheng-Rui Jian
Copyright © 2013 C. L. Gan et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Citations to this Article [3 citations]
The following is the list of published articles that have cited the current article.
- Chong Leong Gan, Classe Francis, Bak Lee Chan, and Uda Hashim, “Extended reliability of gold and copper ball bonds in microelectronic packaging,” Gold Bulletin, 2013.
- C. L. Gan, and U. Hashim, “Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package,” Journal of Materials Science: Materials in Electronics, 2013.
- Hashim Uda, “Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Dop ed Cu Wire in Microelectronics Packaging,” Plos One, vol. 8, no. 11, 2013.