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Journal of Nanomaterials
Volume 2013 (2013), Article ID 486373, 9 pages
http://dx.doi.org/10.1155/2013/486373
Research Article

Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

1Spansion (Penang) Sendirian Berhad, Phase II Industrial Zone, Penang, 11900 Bayan Lepas, Malaysia
2Institute of Nano Electronic Engineering (INEE), Universiti Malaysia Perlis, 01000 Kangar, Perlis, Malaysia
3Spansion Incorporation, Sunnyvale, CA 94085, USA
4Spansion (Thailand) Limited, 229 Moo 4 Changwattana Road, Nonthaburi 11120, Thailand

Received 14 October 2012; Revised 15 December 2012; Accepted 16 December 2012

Academic Editor: Sheng-Rui Jian

Copyright © 2013 C. L. Gan et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

C. L. Gan, E. K. Ng, B. L. Chan, F. C. Classe, T. Kwuanjai, and U. Hashim, “Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging,” Journal of Nanomaterials, vol. 2013, Article ID 486373, 9 pages, 2013. doi:10.1155/2013/486373