Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

<table>Unbiased HAST (85% RH, 130°C) Weibull plotting and its characteristics of PdCu and Au wires used in 110 nm device FBGA 64 package.</table>

Journal of Nanomaterials

Figure 3: Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging 