Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

<table>Component level temperature cycling (−40°C to 150°C) Weibull plotting and its characteristics of PdCu and Au wires used in 110 nm device FBGA 64 package.</table>

Journal of Nanomaterials

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Figure 4

Figure 4: Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging 