Research Article
Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging
Table 2
Summary of IMC diffusion kinetics and activation energies comparing Au and PdCu ball bonds used in 110 nm device packaging.
| IMC Type | HTSL test conditions | (eV) | (m2s−1) | Reference |
| CuAl | 175, 200, 250 | 0.63 to 0.78 | 1.21 × 10−7 | [13, 14] | CuAl | 200, 250, 300 | 1.01 | 1.21 × 10−7 | [15] | CuAl | 150, 200 | 1.34 | 1.63 × 10−4 | [16] | CuAl | Unknown | 2.04 | 2.00 × 10−5 | [17] | CuAl | 175, 200, 225, 250 | 1.26 | 3.70 × 10−5 | [18] | CuAl | 150, 250, 300 | 1.14 | N/A | [19, 20] | CuAl | 150, 175, 200 | 1.18 | 1.43 × | This work | AuAl | Unknown | 1.80 | 9.10 × 10−6 | [17] | AuAl | Unknown | 1.00 | 2.62 × 10−7 | [21] | AuAl | 150, 175, 200 | 1.04 | 1.97 × | This work |
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