Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

Table 3

Determination of IMC diffusion coefficient for each elevated temperatures.

IMC Type/(°C)	𝑥−𝑥𝑜	𝑡 (s); (𝑥1𝐸6),; 500 h	𝐷1 = (𝑥−𝑥0)^2/𝑡; (m^2s^−1)	𝑥−𝑥𝑜	𝑡 (s); (𝑥1𝐸6),; 1000 h	𝐷2 = (𝑥−𝑥0)^2/𝑡; (m^2s^−1)	𝑥−𝑥𝑜	𝑡 (s); (𝑥1𝐸6),; 2000 h	𝐷3 = (𝑥−𝑥0)^2/𝑡; (m^2s^−1)	𝐷 (avg.)
CuAl/150	0.02	1.8	2.22𝐸−22	0.04	1.8	8.89𝐸−22	0.08	3.6	1.78𝐸−21	9.63𝐸−22
CuAl/175	0.06	1.8	2.00𝐸−21	0.04	1.8	8.89𝐸−22	0.11	3.6	3.36𝐸−21	2.08𝐸−21
CuAl/200	0.06	1.8	2.00𝐸−21	0.04	1.8	8.89𝐸−22	0.11	3.6	3.18𝐸−21	2.02𝐸−20
AuAl/150	0.10	1.8	5.12𝐸−21	0.37	1.8	7.69𝐸−20	0.76	3.6	1.60𝐸−19	8.08𝐸−20
AuAl/175	0.32	1.8	5.76𝐸−20	0.84	1.8	3.90𝐸−19	2.91	3.6	2.35𝐸−18	9.33𝐸−19
AuAl/200	0.63	1.8	2.23𝐸−19	0.89	1.8	4.40𝐸−19	3.10	3.6	2.67𝐸−18	1.11𝐸−18