Research Article
Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging
Table 3
Determination of IMC diffusion coefficient for each elevated temperatures.
| IMC Type/(°C) | | (s) (), 500 h | = ()2/ (m2s−1) | | (s) (), 1000 h | = ()2/ (m2s−1) | | (s) (), 2000 h | = ()2/ (m2s−1) | (avg.) |
| CuAl/150 | 0.02 | 1.8 | | 0.04 | 1.8 | | 0.08 | 3.6 | | | CuAl/175 | 0.06 | 1.8 | | 0.04 | 1.8 | | 0.11 | 3.6 | | | CuAl/200 | 0.06 | 1.8 | | 0.04 | 1.8 | | 0.11 | 3.6 | | | AuAl/150 | 0.10 | 1.8 | | 0.37 | 1.8 | | 0.76 | 3.6 | | | AuAl/175 | 0.32 | 1.8 | | 0.84 | 1.8 | | 2.91 | 3.6 | | | AuAl/200 | 0.63 | 1.8 | | 0.89 | 1.8 | | 3.10 | 3.6 | | |
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