Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding
Figure 13
The conductive particle movement analysis results of conventional Ni ACFs, conventional Sn58Bi solder ACFs, and PVDF nanofiber/Sn58Bi solder ACFs. (a) Number of conductive particles on the electrode and (b) conductive particle capture rates before and after bonding.
