Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding

<table>(a) The insulation resistance results of conventional Ni ACFs, conventional Sn58Bi solder ACFs, and PVDF nanofiber/Sn58Bi solder ACFs. (b) The optical image of the short circuit region between the neighboring electrodes of the conventional Sn58Bi solder ACFs. (c) The optical image of the short circuit region between the neighboring electrodes of the conventional Ni ACFs. (d) The optical image of the neighboring electrodes of PVDF nanofiber/Sn58Bi solder ACFs.</table>

Journal of Nanomaterials

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Figure 14

Figure 14: Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding 

Figure 14 | Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding 