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Journal of Nanomaterials
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Journal of Nanomaterials
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2013
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Article
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Fig 4
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Research Article
Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding
Figure 4
The image of (a) U/S bonding apparatus and (b) U/S horn for FOF bonding.
(a)
(b)