Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding
Figure 8
The DSC curve of (a) epoxy base resin containing Sn58Bi solder balls and (b) PVDF nanofiber containing Sn58Bi solder balls.