Effects of Free Surface and Heterogeneous Residual Internal Stress on Stress-Driven Grain Growth in Nanocrystalline Metals

Table 1

Experimental data on deformation induced grain growth in NC metals and alloys.

Material (synthesis)	𝑑initial (nm)	Deformation mode	𝑑final (nm)	Mechanism	Reference
Al (MST)	20	In situ TEM indentation	>100	GBM, GR, GC	[22]
Ni (ED)	45	Compression creep	75	GBS, GR	[23]
Al (MST)	40–90	Tension	>100	Stress coupled GBM	[4]
Co-P (ED)	12	Tension	25	Stress-driven GBM, GC	[24]
Ni-Fe (ED)	23	Tension	250	Stress-driven GB process	[25]
Ni (ED)	30	HPT	130	Stress assisted GR	[8]
Ni (ED)	15	Multi-indentation	<200	GB processes	[26]
Cu (IGC)	36	Compression	90	Stress-driven mechanism	[27]
Ni (ED)	15	In situ TEM tension	>50	GR	[28]
Ni (ED)	37	Rolling	110	GB-dislocation interaction	[29]
Ni (ED); Ni-Fe (ED); Ni-Mn (ED)	42; 25; 115	Fatigue in tension	>500	Diffusional shear stress-driven growth	[30]
Ni-Fe (ED)	20	Rolling	50	GR	[31]
Pt (MST)	20	Tension	33	Stress-driven GB process	[32]
Ni-Fe (ED)	21	HPT	50	GR	[33]

MST: magnetron sputtering technique; IGC: inert gas condensation; ED: electrodeposition; HPT: high pressure torsion; GBM: GB migration; GR: grain rotation; GC: grain coalescence.