249603.fig.004a
(a)
249603.fig.004b
(b)
Figure 4: (a) SWCNT removal efficiency of SDS, SDBS and water as discussed in Section 3. (b) Sample SEM image of the surface of SWNTs deposited silicon wafers before cleaning (AD = 38%) and after wipe cleaning with pure water (AD = 14.7%), SDBS (AD = 3.2%), and SDS surfactant (AD = 2.1%). The average precleaning areal density was approximately 36% for all samples.