Research Article
A Study on the Conductivity Variation of Au Coated Conductive Particles in ACF Packaging Process
Table 1
Material properties of ACF related component.
| | Material | MPa | | CTE (ppm/°C) | MPa | Constitutive equation |
| | Chip (Si) | 128000 | 0.30 | 2.7 | — | Elastic |
| | PCB (Flex) | 4000 | 0.30 | 20 | — | Elastic |
| | Ni-based bump and pad | 233000 at −40°C
227000 at 20°C
221300 at 100°C
214400 at 190°C | 0.30 at −40°C
0.30 at 20°C
0.32 at 100°C
0.38 at 190°C | 12.5 at −40°C
14.5 at 100°C
15.0 at 190°C | 405 | Elastic-plastic |
| | Polymer matrix | 3200 at −40°C
1600 at 20°C
800 at 100°C
200 at 150°C
50 at 190°C | 0.400 at −40°C
0.400 at 20°C
0.450 at 100°C
0.470 at 150°C
0.490 at 190°C | 70.0 at −40°C
70.0 at 130°C
145.0 at 137°C
150.0 at 190°C | — | Elastic |
|
Conductive
particle polymer | 3200 at −40°C
1600 at 20°C
800 at 100°C
200 at 150°C
50 at 190°C | 0.400 at −40°C
0.400 at 20°C
0.450 at 100°C
0.470 at 150°C
0.490 at 190°C | 70.0 at −40°C
70.0 at 130°C
145.0 at 137°C
150.0 at 190°C | — | Elastic |
| | Au film | 77000 | 0.30 | 14.2 | 170 |
Elastic-plastic |
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