A Review on Aerosol-Based Direct-Write and Its Applications for Microelectronics

Table 4

MCS material-substrate compatibility, from Bhattacharya et al. [11], Copyright 2012 ASME. Reprinted with permission.

Substrate	Tin	Aluminum	Copper
Glass	+	+	+
Silicon	+	+	+
BT^1	+	+	−
PEEK^2	−	+	+
Kapton	+	+	−
Teflon	−	+	+
PES^3	−	+	+
LCP^4	−	+	+
Teslin	−	−	+
FR4^5	−	+	−
Mylar	−	+	+

¹Fiberglass-reinforced Bismaleimide Triazine Epoxy.
²Polyether ether ketone.
³Polyethersulfone.
⁴Liquid crystal polymer.
⁵Glass-reinforced epoxy laminate.