(a)

(b)

(c)

(d)

Figure 3: (a) Silicon substrate immediately after FIB milling of SiO2 layer. (b) Illustration of three-phase contact line dragging nanoparticles across the substrate surface. (c) Close-up illustration of particles pushed into milled trenches via the capillary force. (d) Array of nanosphere trimers after deposition is complete.