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Journal of Nanotechnology
Volume 2013 (2013), Article ID 296517, 6 pages
Carbon Nanotube Composites for Electronic Packaging Applications: A Review
Electronics Packaging Laboratory, Technische Universitat Dresden, Helmholtzstraße 10, 01062 Dresden, Germany
Received 31 August 2012; Revised 10 April 2013; Accepted 22 April 2013
Academic Editor: Carlos R. Cabrera
Copyright © 2013 Lavanya Aryasomayajula and Klaus-Juergen Wolter. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Citations to this Article [2 citations]
The following is the list of published articles that have cited the current article.
- Sean W. King, Harsono Simka, Dan Herr, Hiro Akinaga, and Mike Garner, “Research Updates: The three M's (materials, metrology, and modeling) together pave the path to future nanoelectronic technologies,” APL Materials, vol. 1, no. 4, pp. 040701, 2013.
- Sandesh Trivedi, Satish C. Sharma, and S. P. Harsha, “Dynamic Analysis of Single Walled Boron Nitride Nanotube Reinforced Composite Based Nanomechanical Resonator,” Journal of The Institution of Engineers (India): Series D, 2014.