Impact of Bundle Structure on Performance of on-Chip CNT Interconnects
Table 2
Propagation delay of various interconnects for the year 2022.
Comparison chart of propagation delay of copper versus bundled CNT interconnects as per the dimensions predicted for the year 2022 (width × height of the interconnect = 11 nm × 22 nm)
Length of the interconnect
Delay of copper (ps)
Propagation delay of various bundles interconnect geometries (ps)
Sparsely packed bundles of CNTS
Densely packed bundles CNTs
Randomly mixed bundles
Segregated bundles
Proportionately mixed bundles (all the samples of segregated bundles are mixed in equal ratio)
Case 1*: a mix segregated SWCNTs with varying diameters ( nm, 3 nm, and 7 nm). Case 2**: a mix of segregated MWCNT bundles with varying ratio from smallest to largest. 7 nm 1.22 nm (), 3 nm 1.3 nm (), 7 nm 6.32 nm (). Case 3***: a mix of segregated SWCNTs with lowest diameters (1 nm and 3 nm) and segregated MWCNT bundles with lowest ratio—( 7 nm 1.22 nm (), 5 nm 1.26 nm ()). Case 4****: a mix of segregated SWCNTs with largest diameters (7 nm and 5 nm) and segregated MWCNT bundles with largest ratio— 7 nm 6.32 nm (), 5 nm 4.32 nm ().
#Standard deviation of tube diameter variations in a bundle.