- About this Journal ·
- Abstracting and Indexing ·
- Aims and Scope ·
- Annual Issues ·
- Article Processing Charges ·
- Author Guidelines ·
- Bibliographic Information ·
- Citations to this Journal ·
- Contact Information ·
- Editorial Board ·
- Editorial Workflow ·
- Free eTOC Alerts ·
- Publication Ethics ·
- Recently Accepted Articles ·
- Reviewers Acknowledgment ·
- Submit a Manuscript ·
- Subscription Information ·
- Table of Contents
Journal of Nanotechnology
Volume 2014 (2014), Article ID 750959, 10 pages
Time-Domain Analysis of Coupled Carbon Nanotube Interconnects
School of Electrical & Computer Engineering, Tarbiat Modares University (TMU), P.O. Box 14115-194, Tehran, Iran
Received 29 December 2013; Accepted 5 March 2014; Published 4 May 2014
Academic Editor: Carlos R. Cabrera
Copyright © 2014 Davood Fathi. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
- Y. Xu and A. Srivastava, “A model for Carbon Nanotube Interconnects,” International Journal of Circuit Theory and Applications, vol. 38, no. 6, pp. 559–575, 2010.
- C. T. White and T. N. Todorov, “Quantum electronics: Nanotubes go ballistic,” Nature, vol. 411, no. 6838, pp. 649–651, 2001.
- F. Davood and B. Forouzandeh, “A novel approach for stability analysis in carbon nanotube interconnects,” IEEE Electron Device Letters, vol. 30, no. 5, pp. 475–477, 2009.
- A. Naeemi, R. Sarvari, and J. D. Meindl, “Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI),” IEEE Electron Device Letters, vol. 26, no. 2, pp. 84–86, 2005.
- J. Li, Q. Ye, A. Cassell, et al., “Bottom-up approach for carbon nanotubes interconnects,” Applied Physics Letters, vol. 82, pp. 2491–2493, 2003.
- S. Datta, “Electrical resistance: an atomistic view,” Nanotechnology, vol. 15, pp. S433–S451, 2004.
- S. Datta, Electronic Transport in Mesoscopic Systems, Cambridge University Press, New York, NY, USA, 1995.
- N. Srivastava and K. Banerjee, “Performance analysis of carbon nanotube interconnects for VLSI applications,” in Proceedings of the IEEE/ACM International Conference on Computer-Aided Design (ICCAD '05), pp. 383–390, San Jose, Calif, USA, November 2005.
- K. Banerjee and N. Srivastava, “Are carbon nanotubes the future of VLSI interconnections?” in Proceedings of the ACM Design Automation Conference (DAC '06), pp. 809–814, San Francisco, Calif, USA, July 2006.
- P. J. Burke, “Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotubes,” IEEE Transactions on Nanotechnology, vol. 1, no. 3, pp. 129–144, 2002.
- A. Raychowdhury and K. Roy, “Modeling of metallic carbon-nanotube interconnects for circuit simulations and a comparison with Cu interconnects for scaled technologies,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 25, no. 1, pp. 58–65, 2006.
- P. J. Burke, “An RF circuit model for carbon nanotubes,” IEEE Transactions on Nanotechnology, vol. 2, no. 1, pp. 55–58, 2003.
- H. Li, W. Y. Yin, K. Banerjee, and J. F. Mao, “Circuit modeling and performance analysis of multi-walled carbon nanotube interconnects,” IEEE Transactions on Electron Devices, vol. 55, no. 6, pp. 1328–1337, 2008.
- A. Nieuwoudt and Y. Massoud, “Evaluating the impact of resistance in carbon nanotube bundles for VLSI interconnect using diameter-dependent modeling techniques,” IEEE Transactions on Electron Devices, vol. 53, no. 10, pp. 2460–2466, 2006.
- A. Nieuwoudt and Y. Massoud, “Understanding the impact of inductance in carbon nanotube bundles for VLSI interconnect using scalable modeling techniques,” IEEE Transactions on Nanotechnology, vol. 5, no. 6, pp. 758–764, 2006.
- W. Kim, A. Javey, R. Tu, J. Cao, Q. Wang, and H. Dai, “Electrical contacts to carbon nanotubes down to 1 nm in diameter,” Applied Physics Letters, vol. 87, no. 17, Article ID 173101, 2005.
- A. Raychowdhury and K. Roy, “A circuit model for carbon nanotube interconnects: comparative study with Cu interconnects for scaled technologies,” in Proceedings of the IEEE/ACM International Conference on Computer-Aided Design (ICCAD '04), pp. 237–240, November 2004.
- M. F. Yu, B. I. Yakobson, and R. S. Ruoff, “Controlled sliding and pullout of nested shells in individual multiwalled carbon nanotubes,” Journal of Physical Chemistry B, vol. 104, no. 37, pp. 8764–8767, 2000.
- B. Bourlon, C. Miko, L. Forró, D. C. Glattli, and A. Bachtold, “Determination of the intershell conductance in multiwalled carbon nanotubes,” Physical Review Letters, vol. 93, no. 17, pp. 176806/1–176806/4, 2004.
- A. Stetter, J. Vancea, and C. H. Back, “Determination of the intershell conductance in a multiwall carbon nanotube,” Applied Physics Letters, vol. 93, no. 17, Article ID 172103, 2008.
- C. Patrick Yue and S. Simon Wong, “Physical modeling of spiral inductors on silicon,” IEEE Transactions on Electron Devices, vol. 47, no. 3, pp. 560–568, 2000.
- K. Banerjee and A. Mehrotra, “Analysis of on-chip inductance effects for distributed RLC interconnects,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 21, no. 8, pp. 904–915, 2002.
- A. K. Palit, W. Anheier, and J. Schloeffel, “Reduced order long interconnect modeling,” 15. ITG-GI-GMM Workshop Testmethoden und Zuverlässigkeit von Schaltungen und Systemen, Timmendorfer Strand, pp. 42–47, 2003.
- D. Fathi and B. Forouzandeh, “Time domain analysis of carbon nanotube interconnects based on distributed RLC model,” Nano, vol. 4, no. 1, pp. 13–21, 2009.
- D. Fathi, B. Forouzandeh, S. Mohajerzadeh, and R. Sarvari, “Accurate analysis of carbon nanotube interconnects using transmission line model,” Micro and Nano Letters, vol. 4, no. 2, pp. 116–121, 2009.
- D. Fathi, B. Forouzandeh, and R. Sarvari, “A new method for the analysis of transmission property in carbon nanotubes using Green's function,” Applied Physics A, vol. 102, no. 1, pp. 231–238, 2011.
- D. Fathi and R. Sarvari, “A new model for deformed carbon nanotubes using Green's function,” Applied Physics A, vol. 105, no. 4, pp. 875–880, 2011.
- G. A. Shen, S. Namilae, and N. Chandra, “Load transfer issues in the tensile and compressive behavior of multiwall carbon nanotubes,” Materials Science and Engineering A, vol. 429, no. 1-2, pp. 66–73, 2006.
- D. Santo Pietro, C. Tang, and C. Chen, “Enhancing interwall load transfer by vacancy defects in carbon nanotubes,” Applied Physics Letters, vol. 100, no. 3, Article ID 033118, 2012.