Fabrication of Surface Level Cu/SiCp Nanocomposites by Friction Stir Processing Route

Table 2

Box-Behnken design matrix with peak temperature, grain size of Cu, and microhardness.

Run	Std. order	FSP parameters			Peak temperature	Grain size of matrix after FSP	Average hardness
		(rpm)	(mm/min)	(degree)	(°C)	(~µm)	(Hv)
1	14	750	35	1	416	4	167.6
2	15	750	35	1	412	4	166.5
3	3	500	50	1	352	1.5	189.3
4	9	750	20	0	462	5	149.8
5	16	750	35	1	414	4	166.9
6	13	750	35	1	415	4	167.9
7	1	500	20	1	422	3	164.6
8	10	750	50	0	381	3.5	168.3
9	7	500	35	2	358	2	173
10	11	750	20	2	451	5	151.2
11	2	1000	20	1	513	7	148.7
12	6	1000	35	0	438	6	153.7
13	8	1000	35	2	430	6	156.4
14	4	1000	50	1	384	5	168.1
15	5	500	35	0	362	2	171.2
16	17	750	35	1	418	4	167.4
17	12	750	50	2	372	3.5	169.5