Analysis on Structural Stress of 64 × 64 InSb IRFPAs with Temperature Dependent Elastic Underfill

Table 1

Material parameters.

Materials	Elastic modulus; /MPa	Poisson’s ratio; µ	CTE; α/(×10^−6/K)
Si ROIC	163000	0.28	See Figure 1(b)
InSb chip	409000	0.35	See Figure 1(b)
Indium bump	10600	0.45	See Figure 1(b)
Underfill	See (2)	0.3	See Figure 1(a)