Research Article
Formulation and Implementation of Energy Efficient Ultraviolet Curing for Photosensitive Resin-Bound Diamond Wire Saws
Table 1
Experimental conditions in the slicing process.
| Item | Value |
| Wire sawing machine | WXD170 | Workpiece | 44 mm silicon ingot | Wire saw diameter (mm) | 0.28 | Wire saw line speed (m/min) | 2.5 | Wire saw feed speed (mm/min) | 0.375 | Workpiece rotate speed (rpm) | 3.5 | Wire tension (MPa) | 0.2 | Coolant | tap water |
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