About this Journal Submit a Manuscript Table of Contents

Engineering Applications of Intelligent Monitoring and Control

Call for Papers

Monitoring and control have found extensive applications in multiple domains including mechanical engineering, electrical engineering, control engineering, civil engineering, biomedical engineering, micro/nano engineering, and so forth. Intelligent systems have a capability to acquire and apply knowledge in an intelligent manner and have the capabilities of perception, reasoning, learning, and making decisions from incomplete information. Therefore, intelligent system approaches for monitoring and control pave a practical way for a variety of engineering applications in the absence of human interaction.

The main focus of this special issue will be on new and existing intelligent systems whose goal is to monitor and control diverse physical processes with no (or very little) human interaction. The special issue will become an international forum for researchers in all branches of engineering to present and summarize the most recent developments and ideas in intelligent monitoring and control and relevant domains. Potential topics include, but are not limited to:

  • Structural health monitoring, damage assessment, and life prediction
  • Condition monitoring, nondestructive evaluation, and reliability analysis
  • Health and environmental monitoring/prediction
  • Prognosis and diagnosis
  • Intelligent system management
  • System modeling, characterization, identification, and optimization
  • Advanced computational methods, control systems, and automation
  • Artificial neural networks, fuzzy logic systems, and evolutionary computing
  • Process control, motion/force control, vibration control, and fault tolerant control
  • Smart materials and structures, sensors and actuators, and sensor networks
  • Signal processing, communication, modern software and hardware systems, and internet-based control and manufacturing

Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/mpe/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/mpe/eaim/ according to the following timetable:

Manuscript DueFriday, 15 March 2013
First Round of ReviewsFriday, 7 June 2013
Publication DateFriday, 2 August 2013

Lead Guest Editor

  • Qingsong Xu, Department of Electromechanical Engineering, Faculty of Science and Technology, University of Macau, Avenue Padre Tomás Pereira, Taipa, Macau, China

Guest Editors

  • Pak-Kin Wong, Department of Electromechanical Engineering, Faculty of Science and Technology, University of Macau, Avenue Padre Tomás Pereira, Taipa, Macau, China
  • Chengjin Zhang, School of Control Science and Engineering, Shandong University, Jinan 250061, Shandong, China
  • Shane Xie, Department of Mechanical Engineering, The University of Auckland, 20 Symonds Street, Auckland, New Zealand
  • Ping-Lang Yen, Department of Bio-Industrial Mechatronics Engineering, National Taiwan University, No. 1, Section 4, Roosevelt Road, Taipei 10617, Taiwan