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Mathematical Modeling and Optimization for Food Packaging Technologies and Safety

Call for Papers

Food safety issue has attracted increasing attention among scientists around the world. Food packaging safety plays the key role in food preservation and safety, and over 45,000 researchers are engaged in some of the newer high-tech issues such as the modified atmosphere packaging, intelligent food packaging, and active packaging as well as more established novel packaging technologies. Most recently, the research community showed a renewed interest in mathematical methods applied to various food packaging technologies and safety. The main aim of this special issue is to present modeling techniques and computation methods useful for analyzing complex phenomena arisen from food packaging engineering. Papers containing original research work that reflects the recent theoretical advances and experimental results as well as opening new avenues for research are invited on all aspects of object tracking. Potential topics include, but are not limited to:

  • Models for mass/ heat transfer phenomena in food packaging system
  • Asymptotic methods for partial and ordinary differential equations arising in food packaging system
  • New technology and processes on food packaging and associated mathematical problems
  • Food packaging and shelf life
  • Time temperature integrator (TTI) for intelligent food packaging
  • Simulation models for modified atmosphere packaging
  • Food packaging materials and safety assessment of harmful substances
  • Advanced manufacturing and equipment technology for food and food packaging
  • Fundamental theory for food packaging

Before submission, authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/mpe/guidelines. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/mpe/fpt/ according to the following timetable:

Manuscript DueFriday, 6 June 2014
First Round of ReviewsFriday, 29 August 2014
Publication DateFriday, 24 October 2014

Lead Guest Editor

  • Li-xin Lu, Department of Packaging Engineering, Jiangnan University, Jiangnan, China

Guest Editors

  • Kit Keith L. Yam, Department of Food Science, Rutgers, The State University of New Jersey, New Brunswick, NJ, USA
  • Dong Sun Lee, Department of Food Science 8 Biotechnology, Kyungnam University, Changwon, Republic of Korea
  • Zhi-wei Wang, Packaging Engineering Institute, Jinan University, Guangdong, China
  • Panuwat Suppakul, Department of Packaging and Materials Technology, Faculty of Agro- Industry, Kasetsart University, Bangkok, Thailand