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Smart Materials and Systems for High Temperature Applications

Call for Papers

With increasing demands of high temperature applications, recent research and development for high temperature smart materials and systems has achieved much attention. High temperature materials include not only superalloys, but also shape memory alloys, ceramics, various composite materials, and thin films. Smart materials research and development related to high temperature applications is multidisciplinary in nature, for example, physics and chemistry of materials, ceramic science, metallurgy and materials engineering, and mechanical engineering for high temperature applications. For high temperature materials applications, scientists and engineers are concerned with the chemical and physical characterization of materials, the kinetics of reactions, the thermodynamic properties and phase equilibria of systems, the development of new processing methods, high temperature corrosion, oxidation, mechanical properties, creep and fatigue of materials, and ultimately the use of materials for high temperature applications.

The purpose of this special issue is to present original research and review articles for smart materials and systems based on theoretical and experimental findings related to materials processing, development, and characterization for high temperature applications. The issue particularly focuses on metallic materials for example superalloys, shape memory alloys, smart ceramics, composite materials, and thin films and their high temperature applications. Potential topics include, but are not limited to:

  • New smart materials and systems including superalloys, titanium alloys, refractory alloys, and ceramics
  • Shape memory and superelastic alloys and their composites
  • Thin films, fibers, nano/micro particles and wires
  • Composite materials and smart systems
  • Smart environmental resistant marterial for corrosion and oxidation
  • Mechanical properties, creep, fatigue, and reliability of materials

Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/smr/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/smr/smshta/ according to the following timetable:

Manuscript DueFriday, 28 June 2013
First Round of ReviewsFriday, 20 September 2013
Publication DateFriday, 15 November 2013

Lead Guest Editor

  • Muhammad Shahid, Department of Materials Engineering, School of Chemical & Materials Engineering, National University of Science and Technology (NUST), Islamabad, Pakistan

Guest Editors

  • Abdul Wadood, High Temperature Materials Unit, National Institute for Materials Science (NIMS), Tsukuba, Japan
  • Yoko Yamabe-Mitarai, High Temperature Materials Unit, National Institute for Materials Science (NIMS), Tsukuba, Japan
  • Hideki Hosoda, Precision and Intelligence Lab, Tokyo Institute of Technology (TITECH) Japan