A Pull-in Based Test Mechanism for Device Diagnostic and Process Characterization

Table 1

Main nominal parameters of the device (layout dimensions and bulk material mean values).

Parameter	Value
Spring length (l)	340 μm
Spring width (b)	3 μm
Mechanical layer thickness (h)	10.6 μm
Capacitor length (l)	282 μm
Capacitor width (w)	10.6 μm
Capacitor gap (d)	2 μm
Young’s modulus (E)	163 GPa (Poly-Si)
Density (ρ)	2.5 g cm^−3