A Systematic Methodology for Reliability Improvements on SoC-Based Software Defined Radio Systems

Table 1

Thermal characteristics of the employed processors.

Parameters	Model value
Sampling interval	20 ms
Die Thickness	0.15 mm
Core Area (no replication)	0.426213 mm^2
Cache area (L1 + Local I + D)	0.370561 mm^2
Convection Resistance	0.1 K/W
Convection Capacitance	140.4 J/K