Editorial Board

• Roc Berenguer, Centro de Estudios e Investigaciones Técnicas de Gipuzkoa, Spain
• Chien-In Henry Chen, Wright State University, USA
• Kiyoung Choi, Seoul National University, Korea
• Anh Tuan Do, Nanyang Technological Univiersity, Singapore
• Ethan Farquhar, Oak Ridge National Laboratory, USA
• David Hernandez-Garduno, Mobile Integrated Solutions, Texas Instruments, USA
• Lazhar Khriji, Sultan Qaboos University, Oman
• Israel Koren, University of Massachusetts, USA
• David S. Kung, IBM Watson Research Center, USA
• Wolfgang Kunz, University of Kaiserslautern, Germany
• Wieslaw Kuzmicz, IMIO – Politechnika Warszawska, Poland
• Chang-Ho Lee, Qualcomm, USA
• Marcelo Lubaszewski, UFRGS Federal University, Brazil
• Mohamed Masmoudi, National Engineers School of Sfax, Tunisia
• Antonio Mondragon-Torres, Rochester Institute of Technology, USA
• Jose Carlos Monteiro, INESC-ID / IST, TU Lisbon, Portugal
• Farshad Moradi, Aarhus University, Denmark
• Maurizio Palesi, Kore University, Italy
• Rubin A. Parekhji, Texas Instruments (India) Ltd., India
• Zebo Peng, Linkoping University, Sweden
• Gregory Peterson, University of Tennessee - Knoxville, USA
• A. Postula, University of Queensland, Australia
• M. Renovell, Université Montpellier 2, France
• Peter Schwarz, Design Automation Laboratory, Germany
• Jose Silva-Martinez, Texas A&M University, USA
• Luis Miguel Silveira, Technical University of Lisbon, Portugal
• Antonio G. M. Strollo, University of Naples Federico II, Italy
• Junqing Sun, Marvell Semiconductor, USA
• Rached Tourki, Electronic and Micro-Electronic Laboratory, Tunisia
• Spyros Tragoudas, Southern Illinois University, USA
• Sungjoo Yoo, POSTECH university, Korea
• Avi Ziv, IBM Haifa Research Lab, Israel