About this Journal Submit a Manuscript Table of Contents

Advanced VLSI Design Methodologies for Emerging Industrial Multimedia and Communication Applications

Call for Papers

Along with the rapid development of the emerging industrial multimedia communication applications such as new-generation wireless communications, 3D video, and high-efficiency video coding (HEVC), VLSI design methodologies are needed to be advanced to a new technology era to meet the stringent requirements and specifications of the diversified applications. Modern wireless communications with the trends of high data rates and low power consumption are prosperously developing. Multimedia applications require high resolution, high video bit rates, and complex video compression. There are so many industrial applications driving the VLSI design methodologies to an advanced horizon

We invite authors to contribute original research articles as well as review articles addressing advanced VLSI design methodologies for emerging industrial applications. Potential topics include, but are not limited to:

  • RF integrated components
  • Low noise amplifiers and power amplifiers
  • RF receivers, transmitters, transceivers, and SoCs
  • Energy-efficient circuits and systems
  • Multimedia and signal processing SoCs
  • High-performance and low-voltage memory design
  • Microprocessors and graphics processors
  • Display drivers and controllers
  • Image sensors and SoCs
  • Security processors
  • Consumer electronics
  • 3D video technologies

Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/vlsi/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/ according to the following timetable:

Manuscript DueFriday, 26 October 2012
First Round of ReviewsFriday, 18 January 2013
Publication DateFriday, 15 March 2013

Lead Guest Editor

  • Yeong-Kang Lai, Department of Electrical Engineering, National Chung Hsing University, Taichung, Taiwan

Guest Editors

  • Yeong-Lin Lai, Department of Mechatronics Engineering, National Changhua University of Education, Changhua, Taiwan
  • Thomas Schumann, Faculty of Electrical Engineering and Information Technology, Hochschule Darmstadt - University of Applied Sciences, Darmstadt, Germany