Editorial Board

Editor-in-Chief

Luc Vandendorpe, Université Catholique de Louvain, Belgium

Associate Editors

T. D. Abhayapala, Australian National University, Australia
Mohamed Hossam Ahmed, Memorial University of Newfoundland, Canada
Farid Ahmed, Johns Hopkins University Applied Physics Laboratory, USA
A. C. Boucouvalas, University of Peloponnese, Greece
Yuh Shyan Chen, National Taipei University, Taiwan
Pascal Chevalier, Thalès-Communications, France
Chia-Chin Chong, DoCoMo USA Labs, Republic of Korea
Nicolai Czink, ftw. Telecommunications Research Center Vienna, Austria
Daniel Benevides da Costa, Federal University of Ceara , Brazil
S. Dasgupta, University of Iowa, USA
Rodrigo C. De Lamare, Department of Electronics University of York, United Kingdom
Ibrahim Develi, Erciyes University, Turkey
Petar M. Djuric, Stony Brook University, USA
Abraham Fapojuwo, University of Calgary, Canada
Michael Gastpar, University of California at Berkeley, USA
A. B. Gershman, Technical University of Darmstadt, Germany
Wolfgang H. Gerstacker, University of Erlangen Nuremberg, Germany
David Gesbert, Institut Eurécom, France
Zabih F. Ghassemlooy, Northumbria University, United Kingdom
Jean-marie Gorce, Institut National des Sciences Appliquées de Lyon, France
Fabrizio Granelli, Università degli Studi di Trento, Italy
Christian Hartmann, Technische Universität München, Germany
Stefan Kaiser, DOCOMO Euro-Labs, Germany
George K. Karagiannidis, Aristotle University of Thessaloniki, Greece
Chi Chung Ko, National University of Singapore, Singapore
Richard Kozick, Bucknell University, USA
Sangarapillai Lambotharan, Loughborough University, United Kingdom
Vincent Lau, Hong Kong University of Science and Technology, Hong Kong
D. I. Laurenson, University of Edinburgh, United Kingdom
Tho Le-Ngoc, McGill University, Canada
Tongtong Li, Michigan State University, USA
Wei Li, Texas Southern University, USA
Lingjia Liu, Dallas Telecomm. R&D Center, Samsung Electronics, USA
Zhiqiang Liu, US Naval Research Laboratory, USA
Stephen McLaughlin, University of Edinburgh, United Kingdom
Sudip Misra, Indian Institute of Technology Kharagpur, India
Marc Moonen, Katholieke Unviversiteit Leuven, Belgium
Sayandev Mukherjee, DOCOMO Communications Laboratories USA, Inc., USA
Kameswara Rao Namuduri, Electrical Engineering at University of North Texas, USA
Amiya Nayak, University of Ottawa, Canada
Monica Nicoli, Politecnico di Milano, Italy
Ashish Pandharipande, Philips Research, The Netherlands
Jordi Pérez-Romero, Universitat Politècnica de Catalunya (UPC), Spain
Phillip Regalia, Institut National des Télécommunications, France
George S. Tombras, National and Kapodistrian University of Athens, Greece
Athanasios V. Vasilakos, National Technical University of Athens, Greece
Weidong Xiang, University of Michigan, Dearborn, USA
Xueshi Yang, Marvell Semiconductor, USA
Kwan L. Yeung, The University of Hong Kong, Hong Kong
Fei Richard Yu, School of Information Technology, Carleton University, Canada
W. H. Zhuang, University of Waterloo, Canada