User Biography : Prof Fuliang Wang Dr. Fuliang Wang received his PhD in Mechanical Engineering, about thermosonic flip chip bonding, from the Central South University of China at May 2007. Now, he is an associate professor at this university and interest in advanced packaging. He is a member of IEEE CPMT. He has worked on microelectronic packaging for over 10 years since 2003. In addition to experience with ultrasonic bonding process and equipment, his research has focused on reliability evaluation of stack die bonding, properties testing of materials, real time monitoring of complex process, dynamic modeling of flip chip bonding process and microstructure characterization of bonding interface. He has successfully developed an optical method for bump and via inspection in TSV. And the optical strain measurement method and FEM stress molding of TSV are under development to evaluate package stress for TSV process optimization.
Biography Updated on 30 April 2013