Effects of Hard Surface Grinding and Activation on Electroless-Nickel Plating on Cast Aluminium Alloy Substrates

<table class="table-group" width="800px"><tr class="fig-image" id="a"><td><img alt="841619.fig.007a" src="https://static.hindawi.com/articles/jcoat/volume-2014/841619/figures/841619.fig.007a.jpg"/></td></tr><tr class="fig-caption"><td align="center"><table><tr><td><b>(a) </b>Metallic, bright EN deposition</td></tr></table></td></tr><tr class="fig-image" id="b"><td><img alt="841619.fig.007b" src="https://static.hindawi.com/articles/jcoat/volume-2014/841619/figures/841619.fig.007b.jpg"/></td></tr><tr class="fig-caption"><td align="center"><table><tr><td><b>(b) </b>Mixed, bright and dull EN deposition</td></tr></table></td></tr></table>

<table>Micrographs showing EN deposition on (a) NaOH etched as-cast Al alloy surface and (b) HCl etched 1200 <i>μ</i>m polished cast Al substrates at 10 minutes plating time.</table>

Journal of Coatings

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Figure 7

Figure 7: Effects of Hard Surface Grinding and Activation on Electroless-Nickel Plating on Cast Aluminium Alloy Substrates 