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Advances in Optics
Table of Contents
Advances in Optics
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2014
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Article
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Fig 6
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Review Article
Hybrid Materials for Integrated Photonics
Figure 6
Process flow of the hybrid device fabrication with the (a) III/V (unprocessed) die-to-wafer technique, (b) DVS-BCB bonding technique, and (c) transfer printing technique.
(a)
(b)
(c)