CAA of an Air-Cooling System for Electronic Devices

<table class="figure-group"><tr class="fig-image" id="a"><td><object data="https://static.hindawi.com/articles/aav/volume-2016/4785389/figures/4785389.fig.004a.svgz" name="4785389.fig.004a" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(a) </b>Fan domain</td></tr><tr class="fig-image" id="b"><td><object data="https://static.hindawi.com/articles/aav/volume-2016/4785389/figures/4785389.fig.004b.svgz" name="4785389.fig.004b" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(b) </b>Region of an electronic card</td></tr><tr class="fig-image" id="c"><td><object data="https://static.hindawi.com/articles/aav/volume-2016/4785389/figures/4785389.fig.004c.svgz" name="4785389.fig.004c" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(c) </b>Whole simulation domain including inlet and outlet plenum</td></tr></table>

Advances in Acoustics and Vibration

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Figure 4

Figure 4: CAA of an Air-Cooling System for Electronic Devices 