Table of Contents Author Guidelines Submit a Manuscript

Additive Manufacturing for Vibration and Noise Control

Call for Papers

Additive manufacturing (AM) is capable of producing three-dimensional structures from precursor materials, and it has the ability to create complex, net-shaped parts with little waste material using a single automated process. AM has become popular in the production of components with complicated structures. This has facilitated innovative technological solutions to be conceived that could not be constructed using traditional manufacturing methods. Vibration and noise control are important issues in practical engineering, especially for the AM. The special issue will focus on use of AM in the development of technologies, such as acoustic absorbers, diffusers, and vibration dampers, to reduce noise and vibration, and recent attempts in mechanical modeling, materials simulation, processing, monitoring, and new and composite materials for AM.

Authors are invited to submit original researches to this special issue. We also hope to attract review articles discussing the current state of the art and future directions in relative research fields of AM.

Potential topics include but are not limited to the following:

  • Advanced technologies in AM to reduce noise and vibration
  • Modeling and simulation in AM, especially the finite element approaches, meshless methods, and other simulation techniques
  • Mechanics problems and solutions in AM
  • Acoustic absorbers and diffusers, aeroengine acoustic liners, metamaterials for sound and vibration attenuation, and vibration dampers
  • Advancements in AM processes
  • Processing of materials in AM and for use in AM
  • Composite structures, advanced materials, and new material formulations for AM
  • Damage detection and health monitoring of AM structures

Authors can submit their manuscripts through the Manuscript Tracking System at https://mts.hindawi.com/submit/journals/aav/amvnc/.

Submission DeadlineFriday, 15 June 2018
Publication DateNovember 2018

Papers are published upon acceptance, regardless of the Special Issue publication date.

Lead Guest Editor

  • Ping Xiang, Central South University, Changsha, China

Guest Editors

  • Jianwei Yan, Jinan University, Guangdong, China
  • Gareth Bennett, University of Dublin, Dublin, Ireland
  • Huaping Wang, The Hong Kong Polytechnic University, Hung Hom, Hong Kong
  • Hui Yao, Michigan Technological University, Houghton, USA