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Advances in Civil Engineering
Volume 2012 (2012), Article ID 402179, 10 pages
http://dx.doi.org/10.1155/2012/402179
Research Article

Dual Mode Sensing with Low-Profile Piezoelectric Thin Wafer Sensors for Steel Bridge Crack Detection and Diagnosis

1Department of Mechanical Engineering, University of South Carolina, Columbia, SC 29208, USA
2Mistras Group Inc., 195 Clarksville Road, Princeton Junction, NJ 08550, USA
3Department of Civil Engineering, University of South Carolina, Columbia, SC 29208, USA

Received 30 May 2011; Accepted 6 September 2011

Academic Editor: Piervincenzo Rizzo

Copyright © 2012 Lingyu Yu et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Lingyu Yu, Sepandarmaz Momeni, Valery Godinez, Victor Giurgiutiu, Paul Ziehl, and Jianguo Yu, “Dual Mode Sensing with Low-Profile Piezoelectric Thin Wafer Sensors for Steel Bridge Crack Detection and Diagnosis,” Advances in Civil Engineering, vol. 2012, Article ID 402179, 10 pages, 2012. doi:10.1155/2012/402179