Advances in Civil Engineering / 2018 / Article / Fig 6

Research Article

Utilization of Electroplating Sludge as Subgrade Backfill Materials: Mechanical and Environmental Risk Evaluation

Figure 6

SEM micrographs of 14-day cured solidified sludge with different binder formulation. (a) 20% PC. (b) 20% PC + 10% CFA.
(a)
(b)

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